JANKCE1N5804

Manufacturer
Microchip Technology
Supplier
VBOM
Package
Die
Description
DIODE GEN PURP 100V 1A DIE
Stock
In stock

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Specifications

Mfr
Microchip Technology
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
Military, MIL-PRF-19500/477
Package
Tape & Reel (TR)
Technology
Standard
Mounting Type
Surface Mount
Package / Case
Die
Product Status
Active
Capacitance @ Vr, F
25pF @ 10V, 1MHz
Supplier Device Package
Die
Reverse Recovery Time (trr)
25 ns
Current - Reverse Leakage @ Vr
1 µA @ 100 V
Voltage - DC Reverse (Vr) (Max)
100 V
Current - Average Rectified (Io)
1A
Operating Temperature - Junction
-65°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
875 mV @ 1 A