JANHCE1N5809

Manufacturer
Microchip Technology
Supplier
VBOM
Package
Die
Description
DIODE GEN PURP 100V 3A DIE
Stock
In stock

Online price and stock are only for reference, please email to sales@vbom.com to receive an official offer, thanks.

Request a quote

Provide your requirement and our team will respond.

Specifications

Mfr
Microchip Technology
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Package
Bulk
Technology
Standard
Mounting Type
Surface Mount
Package / Case
Die
Product Status
Active
Capacitance @ Vr, F
60pF @ 10V, 1MHz
Supplier Device Package
Die
Reverse Recovery Time (trr)
30 ns
Current - Reverse Leakage @ Vr
5 µA @ 100 V
Voltage - DC Reverse (Vr) (Max)
100 V
Current - Average Rectified (Io)
3A
Operating Temperature - Junction
-65°C ~ 175°C
Voltage - Forward (Vf) (Max) @ If
875 mV @ 4 A