CUS08F30,H3F

CUS08F30,H3F
Manufacturer
Toshiba Semiconductor and Storage
Supplier
VBOM
Package
USC
Delivery time
20 Weeks
Packaging
Cut Tape (CT) & Digi-Reel®
Description
DIODE SCHOTTKY 30V 800MA USC
Stock
In stock

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Specifications

Mfr
Toshiba Semiconductor and Storage
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Package
Tape & Reel (TR)
Technology
Schottky
Mounting Type
Surface Mount
Package / Case
SC-76, SOD-323
Product Status
Active
Base Product Number
CUS08F30
Capacitance @ Vr, F
170pF @ 0V, 1MHz
Supplier Device Package
USC
Current - Reverse Leakage @ Vr
50 µA @ 30 V
Voltage - DC Reverse (Vr) (Max)
30 V
Current - Average Rectified (Io)
800mA
Operating Temperature - Junction
125°C (Max)
Voltage - Forward (Vf) (Max) @ If
220 mV @ 10 mA